Semiconductors & Data Centres

India's fab and DC buildout will run on yield data and sovereign telemetry.

Nirmit: sovereign yield and telemetry systems built for India's fab buildout. Two design partners in 2026.

The Opportunity

New Fabs & DCs Need New Data Infrastructure

India's new semiconductor fabs and data centre capacity are coming online without production-grade yield data pipelines or sovereign telemetry systems. Global vendors can't be trusted with this data. Building the infrastructure in-house while manufacturing ramps is impossible. We're filling that gap.

Challenge

Yield data handling at fab scale. Real-time anomaly detection. Zero latency for production decisions.

Sovereignty

Data residency non-negotiable. Telemetry infrastructure must stay within India.

What We're Building

Yield Data Pipelines

Production-grade ingestion and aggregation from equipment sensors. Tool-agnostic architecture.

Sovereign Telemetry Infrastructure

On-premise or India-hosted. Zero cross-border data movement. Full compliance with data residency mandates.

Real-Time Anomaly Detection

ML-driven yield prediction and defect classification. Sub-second latency for production line decisions.

DC Operations & Observability

Environmental telemetry, power consumption analytics, predictive cooling infrastructure.

TARANG SEMICONDUCTORS · OSAT · TEST FLOOR BDEVICE: TSC-PMIC-220LOT: TS-4471-08 · WAFER 14/25PROBE: ET-04 CH-BYIELD RAILS · DATADIVES · FICTIONAL DATA
Wafer map · sort bins
72.0%
Bin 7 (Vdd leakage) rings the wafer edge, heaviest NE quadrant — a spatial signature, not random defectivity. Tap Bin 7 in the legend to isolate it.
Fail-bin pareto · this wafer
Bin 7 · Vdd leakage
71
Bin 5 · speed grade fail
21
Bin 3 · continuity fail
15
Bin 9 · param drift
13
One bin owns 59% of the loss. Chase that, ignore the noise.
Lot genealogy · yield vs probe tool / chamber
Lot
Tool / Ch
Yield
Signature
TS-4471-05
ET-02 / A
96.2%
nominal
TS-4471-06
ET-04 / A
95.8%
nominal
TS-4471-07
ET-04 / B
89.4%
edge Bin-7 ring
TS-4471-08
ET-04 / B
84.1%
edge Bin-7 ring
TS-4471-09
ET-02 / A
96%
nominal
Root-cause candidate: every low-yield lot crossed ET-04 chamber B; lots on ET-02/A are nominal. Edge-ring Vdd leakage on one chamber points at contactor wear or chuck-edge temperature — not the die design. This correlation took the rails 0 minutes: MES lot history, probe logs and bin maps land in one queryable store as they're generated. Your engineers found it in week 3 last time — after two more lots shipped at 84%.

The Payoff

Yield Acceleration

Production data flowing from day one. Faster ramp to commercial yields on new fab lines.

Sovereign Data Infrastructure

Zero reliance on foreign cloud for production telemetry. India-first data governance.

Operational Intelligence

Real-time visibility into defect modes, equipment health, and environmental factors.

Competitive Advantage

Build a proprietary yield prediction model. Data becomes a defensible moat.

Accepting new projects

Ready to make your
data AI-ready?

Let's discuss how we can build trusted data foundations for your AI. Book a free data-readiness call with our team today.

Get in touch

Tell us about your project

What are you interested in?

We'll never share your details. Response within one business day.